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Company Overview. Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding …

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Manufactures precision cutting blades, grinding wheels and other advanced cutting products DISCO Corp. engages in the manufacturing and sale of precision processing equipment.

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DISCO Corporation All rights reserved Solutions for thinning, dicing and packaging of power devices ... www.dicing-grinding.com DISCO HI-TEC EUROPE

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DISCO HI-TEC EUROPE . Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax: +49 89 909 03-199. [email protected]

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DISCO Corporation (ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding …

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Description. Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and ...

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Company profile for solar equipment manufacturer Disco Corporation - showing the company's contact details and products manufactured.

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Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

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Jan 25, 2018· A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a

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Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process. ... grinding, and polishing ... Along with providing equipment …